Wire Saw Micron Diamond

Wire Saw Micron Diamond

Wire Saw Micron Diamond is mainly used for making wire saw, cutting monocrystalline silicon, polycrystalline silicon, sapphire, semiconductor, LCD glass.

Item Name: Wire Saw Micron Diamond

Size: 5-10~40-60

Applications: Specially for wire saw

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Introduction

Crownkyn Superhard wire saw diamond was made by using high-strength and high-purity MBD series diamonds as raw materials, through precision production and processing technology, the products have regular crystal shape, uniform and concentrated particle size distribution, high surface finish, extremely low impurity content, good thermal stability and high wear resistance. Because the particle surface is clean, it is more conducive to plating. Large particles and particle aspect ratio control are extremely strict, the particle size distribution is concentrated, and the effective abrasive content is high.

Features

  • Concentrated particle distribution
  • High surface finish
  • Low impurity content
  • High effective abrasive content

Applications

Wire saw micron diamond is mainly used to make wire saw for cutting single crystal silicon, polysilicon, sapphire, semiconductor, LCD glass, magnetic materials.

Type

Size(μm) MBDM RVDM PCDM WSDM PDM PLM
0-0.25
0-0.5
0-1
0-2
1-2
1-3
1.5-3
2-3
2-4
3-6
3-7
4-6
4-8
4-9
5-10
6-12
8-12
7-14
8-16
10-20
12-22
15-25
20-30
20-40
22-36
30-40
35-45
36-54
40-60

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